Sculpting the future at the finest scale

CUHK chip design software aims for the global market

11 February 2026

This is part three of our series that talks to principal investigators of the four pioneering research projects that have received funds from the Research Grants Council’s under the Areas of Excellence Scheme and Theme-based Research Scheme 2025–26.

Behind today’s ever-shrinking, faster and more efficient electronic devices are fingernail-sized chips. On these semiconductor chips, engineers push the limits of arranging billions of components in flawless order to create the intelligence that powers modern life.

At CUHK, Professor Evangeline Young Fung-yu, Chairperson of the Department of Computer Science and Engineering, is leading a multi-regional effort to create design software that would tackle this intricate “chip puzzle”, which is awarded HK$68.585 million under the Research Grants Council’s Theme-based Research Scheme.

What is more, the team hopes its tool would transform the market landscape by challenging the dominance of major EDA firms, whose software now serves most semiconductor chip design companies round the world.

The resulting software of Professor Young’s team should be capable of orchestrating billions of components on a nanochip to cut computation time drastically. By creating a homegrown alternative with improved performance, the project aims to help Hong Kong establish itself as a global hub for integrated circuit innovation in the long run.

“Our goal is to deliver our innovation to the market and gradually extend its reach worldwide in five years,” she says.

Led by CUHK, the international team assembles scholars and researchers from Hong Kong Baptist University, the University of Hong Kong, the Hong Kong University of Science and Technology, the University of Wisconsin-Madison in the US, the Technical University of Munich in Germany and technology companies based in Taiwan.

Chiplet-Package Co-Design in 2.5D System needs next-gen EDA

Dizzying diminution in three decades

Professor Young chose her specialty years ago, way before the semiconductor chip enabled smartphones and other portable gadgets to proliferate.

She embarked on chip engineering at the University of Texas at Austin, which had admitted her to research into electronic design automation (EDA) at PhD level after she earned Bachelor’s and MPhil degrees at CUHK. Now a Fellow of the Institute of Electrical and Electronics Engineers, she tells CUHK in Focus about EDA, the field that quietly drives the digital foundations of contemporary society.

“Nowadays, everyone carries with them a VLSI, the small black chip inside their computer or mobile phone,” she says. “That is actually a very-large-scale integration (VLSI)”, which is an engineering miracle that has grown ever faster and smaller as technology advances.

VLSI integrates millions – now billions – of transistors, wiring networks and other electronic components onto a single chip, forming the “brain” of computers and smartphones. When Professor Young began her PhD journey in the 1990s, semiconductor chip technology measured 250 nanometres, 1 nanometre being a billionth of a metre. Today, that scale has shrunk to just 3 nanometres even as component counts soar from the millions to billions.

“A 2cm x 2cm chip now contains more elements than the population of an entire nation,” she says. “It is impossible to achieve both speed and precision in such a confined space without the right design tools.” The design of these ultra-dense circuits has long surpassed manual human manoeuvring; every stage, from logic synthesis, placement, routing, simulation to analysis and verification, all relies on advanced EDA design software.

‘Factory of 10,000 workers’

The demands of modern computing have called for increasingly complex VLSI designs. Yet most existing EDA tools in the market still run solely on central processing units (CPUs), which may lack the speed and capacity to manage today’s immense and intricate circuit designs.

To overcome these limits, Professor Young and her team are developing next-generation EDA software powered by graphics processing units (GPUs). “GPUs contain tens of thousands of parallel, specialised cores, making them very suitable to tackle the computational demands of next-generation chip design.”

The team aims to cut computation time to as little as a 20th or even a 50th of current levels. “At present, it can take days to process a medium-sized circuit. We hope to bring that down to hours or even minutes,” Professor Young says. She is under no illusion about the enormity of the challenge. “A GPU is like a vast factory of 10,000 workers – if not managed properly, it can just as easily slow things down as speed them up.”

In parallel, the team is creating a large circuit model (LCM), an artificial intelligence system purpose-built for VLSI design. In the future, by inputting functional and structural descriptions, the LCM will instantly predict circuit performance, while circuit designers can refine their design using AI.

The project brings together professors at the Department of Computer Science and Engineering: (from left) Xu Qiang; Evangeline Young, who specialises in GPU acceleration; Ho Tsung-yi, studying heterogeneous integration; and Yu Bei. Professors Xu and Yu focus on LCM and AI

Smarter electronics

The latest generation of semiconductor chips requires packaging components with different functions, sizes and materials into a single multi-layered system. This process, known as 3D heterogeneous integration, boosts performance far beyond traditional 2D chips. However, it also creates complex design challenges that current EDA tools struggle to manage effectively and automatically.

The EDA software that Professor Young’s team is developing seeks to eliminate this bottleneck by combining GPU acceleration, LCM and AI technologies. This advanced system will optimise the placement of billions of components in 3D space and enable elements to operate seamlessly within a single chip. It can also simulate signal transmission, current flow and power usage, using AI to detect and refine potential issues.

The team looks forward to superior chip design tools that drive faster, more powerful and more compact electronic devices for users worldwide.

The Department of Computer Science and Engineering is training about 50 PhD students, and Professor Young (centre) hopes it can cultivate more talent in the years ahead

Hong Kong as new EDA hub

Professor Young envisions establishing an EDA research centre at CUHK to attract more talent and deepen international collaboration.

“CUHK has long been at the forefront of EDA research,” she says. “We’ve brought together leading experts in the area. With support from the Research Grants Council (RGC), we plan to recruit more top EDA talents and enhance our capabilities with high-performance hardware.”

Ultimately, the professor has high hopes for Hong Kong in the global supply chain of semiconductor chips. She believes EDA research will contribute to the city’s role and competitiveness in the market in time to come.

By Jessica Chu
Photos by Yau Hung-kee

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