Eight CUHK students awarded Innovation and Technology Scholarships
16 July 2025
Eight outstanding students from CUHK have been awarded the Innovation and Technology Scholarship 2025, the highest number among all participating institutions. Established to recognise talented students who possess a passion for innovation and technology, the scholarships allows them to pursue opportunities that widen their international exposure and gain industry experience, nurturing their commitment to science and technology.
The scholarship was stablished in 2011 by the Innovation and Technology Commission of the Hong Kong government, The Hongkong and Shanghai Banking Corporation Limited and The Hong Kong Federation of Youth Groups. Awardees are nominated by their universities, after which 25 are selected by an Awardee Selection Committee with members from different sectors. Each awardee receives up to HK$150,000 for future participation in a series of elite training programmes, including overseas/mainland research attachments and a service project programme.
Wong Wai-hiu, an awardee and a third-year student in Architectural Studies, will study for a semester at The Pennsylvania State University’s renowned architecture school with full sponsorship from the scholarship. He said: “The school focuses on environmental sustainability and relevant construction technologies, which perfectly aligns with my career goal of becoming a green architect and construction manager. I am excited to bring back what I learn to CUHK and contribute to sustainability efforts in Hong Kong.”
Another awardee, Chow King-ngai, is a fourth-year MBChB (Global Physician-Leadership Stream) student advancing a new technology called 3D histology, which has the potential to improve cancer diagnosis methods. “Using 3D histology to train histopathology AI with the dream of diagnosing cancer automatically with AI, I applied for the scholarship to get more opportunities to learn from top researchers worldwide,” he says. With the scholarship’s support, Chow will have the opportunity to learn about medical AI at Osaka Metropolitan University, as well as attend the European Congress of Pathology to present his research findings on 3D histology and discover the latest research developments.